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3M 5433 Kapton tape

3M 5433 with DuPont™ Kapton® polyimide film and silicone adhesive used for PCB solder masking and other high-temperature applications. Low Static. Lined.

  • Brand: 3M
  • Model No.: 5433
  • Color: Amber
  • Adhesive: Acrylic
  • Length: 33m
  • Temperature range: 180 ℃
  • Die-cutting: Any shape and any size
  • Width: Cutting any width
Data Sheet

3M 5433 Kapton tape Data Sheet

Adhesion to SteelD-333020 oz./in. width (22 N/100 mm)
Tensile Strength at BreakD-375933 lbs./in. width (578 N/100 mm)
Elongation at BreakD-375960%
Backing ThicknessD-36521 mil (0.03 mm)
Liner ThicknessD-36523 mil (0.08 mm)
Total Tape ThicknessD-36522.7 mil (0.07 mm)
Temperature Use Range-73° to 260°C) -100° to 500°F
Dielectric StrengthD-1497000 volts
Insulation Resistance>1*106 ohms
Static Charge(measured at 50% RH, 70°F (21°C) in an ESD
controlled environment)
Removal from Liner<100 volts
Removal from PWBDependent on PWB substrate, generally less than
500 volts
OutgassingE-595%TLM = 0.58; %CVCM = 0.24
Flame Retardancyper UL-510 product category:
OANZ2 File E230409

3M 5433 Kapton tape Features

  • Polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
  • Dimensionally stable at high temperatures, which prevents rework, enabling high productivity
  • Flame retardant, chemical, and radiation-resistant which protects surfaces to help reduce replacement costs
  • Silicone adhesive's high-temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
  • Low Static which virtually eliminates circuit board degradation due to electrostatic discharge
  • Helps reduce costly board waste due to component failure
  • The unique release liner is easy to release from silicone adhesive, which provides the capability to produce die-cut parts
  • Available on cardboard or polyethylene core
  • Halogen Free

3M 5433 Kapton tape Applications

  • Mask for printed circuit boards during wave solder or solder dip process
  • Used as release surface in the fabrication of parts cured at elevated temperatures

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