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Copper Clad Polyimide Film

Copper Clad Polyimide Film

Copper Clad Polyimide Film is made of flexible Copper laminated with Polyimide film. It’s widely used as flexible printed circuits (FPCs)

Copper Clad Polyimide FilmFeatures:

  • Excellent electrical, thermal, and heat resistance
  • Flame, Radiation, retardant property.
  • High bond and dielectric strength.
  • Excellent voltage resistance and tensile strength.
  • Excellent balance of the electrical, chemical, and physical property
Data Sheet
Thickness
Structure
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Copper Clad Polyimide Film Data Sheet

ItemUnitData
Polyimide Film
Tensile StrengthMD/ MPa≥ 135
TD/ MPa≥ 110
ElongationMD  / %≥ 35
TD  / %≥40
Breakdown StrengthKV/mm≥ 120
Volume resistivity 200+/-5c(392F)Ω · m≥ 1 × 10^13
Surface resistance 200+/-5c(392F)Ω≥ 1 × 10^10
Dielectric dissipation factor 50Hz≤ 1.0 × 10^3
Copper
Thermal Stress (float288/unetched)Sec≥ 10
Warpage (without treatment)%≤ 1.0
Cu Surface resistance≥ 1 × 10⁵
Dielectric constant1MHz≤4.0
Dissipation Factor1MHz≤0.035
FlammabilityUL94V-0
Moisture absorption%≤0.8
Chemical ResistancePass

Copper Clad Polyimide Film Thickness

Thickness(μm)Copper353518351835
Adhesive132525252525
Polyimide131325255050
Copper353518351835
Adhesive132525252525
Polyimide131325255050
Adhesive132525252525
Copper353518351835

Copper Clad Polyimide Film Structure

Copper Clad Polyimide Film Stucture

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